Microelectronics Packaging:LEADER IN THE SCIENCE AND ART OF MICROELECTRONICS
For over 50 years, Teledyne Microelectronics has met the challenge with creative packaging solutions for today’s most demanding applications.
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[ RF ][ Microwave ][ Optoelectronics ][ Space ][ High Density Interconnect ][ Medical Devices ][ Secure Communications ] |
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Technical Documentation |
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Please see the document for details |
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WLP;CSP;MCM;MCA;BGA;CGA;COB;SMT |
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English Chinese Chinese and English Japanese |
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160726 |
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2.6 MB |
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