LEADER IN THE
SCIENCE AND ART OF
MICROELECTRONICS
Microelectronics Packaging
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Contact our team to nd out how we can help solve your toughest technology challenges.
800.518.1015
microelectronics@teledyne.com
LEADER IN THE SCIENCE AND ART OF MICROELECTRONICS
In this world of rapidly changing technologies, one constant is the need for continually increasing the
density of electronic circuits to meet the size and weight constraints of ever more complex systems.
For over 50 years, Teledyne Microelectronics has met the challenge with creative packaging solutions
for today’s most demanding applications.
Optimize SWAP: Size, Weight, Power and Performance
Our dedicated team of scientists and engineers work with you to optimize
your size, weight and performance requirements through:
• Circuit layout design
• Mechanical analysis
• Materials selection
• Thermal and power management analysis
• Power Integrity (PI) and Signal Integrity (SI) analysis
Services
At any phase of your design, we work with you to provide a cost effective,
innovative packaging solution. Reliability and producibility are designed into
every circuit, achieving a state-of-the-art quality product.
Advanced Technologies
We utilize a full array of advanced technologies to achieve optimal packaging
for your circuit:
• WLP - Wafer Level Packaging • Flip Chip/Flip Chip on Flex
• CSP - Chip Scale Packaging • BGA/CGA - Ball/Column Grid Array
��� SIP - System in Package • Solder and Stud Bumping
• MCM - Multichip Module • COB - Chip on Board
• MCA - Microwave Assembly • SMT - Surface Mount Technology
Quality
Every employee is committed to producing the highest quality product.
We are a DoD DMEA Microelectronics Trusted Source, accredited for
Microelectronics Packaging, Assembly and Test Services and maintain the
highest level industry certications:
• AS9100
• ISO 9001:2008
• MIL-PRF-38534, Class H and K