Die Thickness Change and Add Additional Manufacturing Locations for DDR 5RCD PA210009(R2)

PublishTime：2021-07-22

●Subject: Die Thickness Change and Add Additional Manufacturing Locations for DDR5 RCD
●Publication Date: 7/22/2021
●Effective Date: Follow Implementation Date per below Table.
●Revision Description:
■Revision 2: This revision is to update Qualification results on SCK 10 mil die thickness, which was completed successfully on July 16, 2021.
●Description of Change:
■Renesas is changing the die thickness from 8mil to 10mil for better warpage performance. Internal qualification on the first lot has been successfully completed. Refer attach Qualification report.

Brand of Product：	Renesas
Part#：	5RCD0148HC3AVG 、 5RCD0148HC3AVG8 、 5RCD0148HC3AVGI 、 5RCD0148HC3AVGI8 、 5RCD0148 More Part#
Product Category：	DDR More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	FCCSP 240
Language：	English Chinese Chinese and English Japanese
Date of Creation：	7/22/2021
Version Number：
Data Encoding：	PA210009(R2)
Data Size：	1.2 MB

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