PCN20029A: Alternate bond wire material and assembly facility of the listed Renesas QFN packaged products
2021-05-24
●Revision Description: Initial Release
■Revision A : Changes are in RED font.
◆1.Include Final PCN publication datea
◆2.Update PCN Effective Date from 07/31/2021 to 08/15/2021
◆3.Clarification of Final PCN and MSL change after roll out of Copper wire bonding.
◆4.Update assembly site code for Copper wire assembled at UTL
◆5.Qualification status has changed from “In Progress” to “Completed”
◆6.Include disclaimer for sample orders.
◆7.Update sample availability date 07/05/2021
◆8.Update affected product list.
◆9.Update PCN20029 with Reliability Test Result(Appendix B)
●Description of Change: Alternate bond wire material and assembly facility of the listed Renesas QFN packaged products
■UTAC Thai Ltd., Bangkok, Thailand(UTL)
●List of changes :
■Table 1 –Adding UTL as alternate assembly site, Wire material change from Gold to Copper and Standardize Moisture Sensitivity Level to MSL3.
■Table 2 -AddingUTLas alternate assembly site.
●This notice is an update to PCN20029 (which was published on Nov 02,2020).Renesas Electronics America (REA) will begin to use UTL as alternate assembly of the listed Renesas DFN, QFN, TDFN, TQFN package products.
●Reason for Change: The assembly capacity worldwide is in highly competitive space. In order to secure the capacity ahead, Renesas has qualified the key package families to add alternate sources. These places will be utilized only if there is a shortfall in the supply. Adding UTL as alternate assembly site will expand current capabilities and capacities to optimize Renesas’s ability to meet customer’s delivery requirements. UTLfacility is ISO9001:2015 and IATF 16949:2016 certified. UTL is existing assembly supplier for high volume assembly of QFN packaged products with both gold and copper bond wire material.
■Revision A : Changes are in RED font.
◆1.Include Final PCN publication datea
◆2.Update PCN Effective Date from 07/31/2021 to 08/15/2021
◆3.Clarification of Final PCN and MSL change after roll out of Copper wire bonding.
◆4.Update assembly site code for Copper wire assembled at UTL
◆5.Qualification status has changed from “In Progress” to “Completed”
◆6.Include disclaimer for sample orders.
◆7.Update sample availability date 07/05/2021
◆8.Update affected product list.
◆9.Update PCN20029 with Reliability Test Result(Appendix B)
●Description of Change: Alternate bond wire material and assembly facility of the listed Renesas QFN packaged products
■UTAC Thai Ltd., Bangkok, Thailand(UTL)
●List of changes :
■Table 1 –Adding UTL as alternate assembly site, Wire material change from Gold to Copper and Standardize Moisture Sensitivity Level to MSL3.
■Table 2 -AddingUTLas alternate assembly site.
●This notice is an update to PCN20029 (which was published on Nov 02,2020).Renesas Electronics America (REA) will begin to use UTL as alternate assembly of the listed Renesas DFN, QFN, TDFN, TQFN package products.
●Reason for Change: The assembly capacity worldwide is in highly competitive space. In order to secure the capacity ahead, Renesas has qualified the key package families to add alternate sources. These places will be utilized only if there is a shortfall in the supply. Adding UTL as alternate assembly site will expand current capabilities and capacities to optimize Renesas’s ability to meet customer’s delivery requirements. UTLfacility is ISO9001:2015 and IATF 16949:2016 certified. UTL is existing assembly supplier for high volume assembly of QFN packaged products with both gold and copper bond wire material.
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