2007626 1X4 CAGE ASSEMBLY, BEHIND BEZEL,W/ SQUARE LIGHT PIPES AND HEAT SINKS, QSFP CUSTOMER DRAWING
■HEAT SINK MATERIAL: ALUMINUM
■HEAT SINK CLIP MATERIAL: STAINLESS STEEL
■EMI SPRING MATERIAL: COPPER ALLOY
■FRONT FLANGE MATERIAL: ZINC ALLOY
■LIGHT PIPE MATERIAL: CLEAR POLYCARBONATE
●PITCH BETWEEN PORTS OF ONE 1X4 CAGE ASSEMBLY.
● SPACING BETWEEN CAGES ON THE SAME PC BOARD, TO BE SPECIFIED BY CUSTOMER, MUST COMPLY WITH MINIMUM DIMENSIONS SHOWN.
●REFERENCE APPLICATION SPEC 114-13218 FOR RECOMMENDED DRILL HOLE DIAMETER AND PLATING THICKNESS.
●DATUMS AND BASIC DIMENSIONS ESTABLISHED BY CUSTOMER.
●DIMENSION C IS THE NOMINAL THICKNESS OF CUSTOMER SUPPLIED PC BOARD,
■SINGLE SIDED PC BOARD MINIMUM THICKNESS = 1.45mm
■DOUBLE SIDED PC BOARD MINIMUM THICKNESS = 2.2mm PER QSFP.
●HEAT SINKS, LIGHT PIPES, AND CLIP SHIPPED ASSEMBLED TO CAGE ASSEMBLY.CAGE ASSEMBLY MAY BE PRESSED INTO THE PCB AS SHIPPED.
●DATUM -A- IS TOP SURFACE OF PC BOARD.
●DIMENSION APPLIES WITH MODULE INSERTED IN CAGE.
●UNPLATED THRU HOLE.
●MAXIMUM HEIGHT OF LED OFF BOARD: 0.9mm.
●MATES WITH QSFP MSA COMPATIBLE TRANSCEIVER.
●SURFACE TRACES PERMITTED WITHIN THIS AREA EXCEPT WHERE CAGE STANDOFFS,SHOWN IN DETAIL S, CONTACT PC BOARD.
● BASELINE FOR THESE DIMENSIONS IS THE CENTER OF COMPLIANT PIN HOLE.
●2D BARCODE AND DATE CODE (YYWWD) MARKED ON SIDE OF CAGE ASSEMBLY.
●REFERENCE APP SPEC 114-13218 FOR GASKET THICKNESS CALCULATION.
●EMI SPRING FINISH: 2μm MINIMUM TIN
■FRONT FLANGE FINISH: 3μm MINIMUM TIN OVER 1.27μm MINIMUM NICKEL OVER 5.08μm MINIMUM COPPER
■HEAT SINK FINISH: NICKEL.
●HEAT SINKS AND CLIPS SHIPPED ASSEMBLED TO CAGE ASSEMBLY. CAGE ASSEMBLY MAY BE PRESSED INTO THE PCB AS SHIPPED. LIGHT PIPES, SHIPPED UNATTACHED, MUST BE ASSEMBLED BY CUSTOMER AFTER THE CAGE IS SEATED IN THE PCB.
|
|
|
|
Product Drawing |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
3 DEC 2014 |
|
|
REVISION F |
|
|
C-2007626 |
|
|
2.2 MB |
- +1 Like
- Add to Favorites
Recommend
- TE Connectivity to acquire antennas business from Laird Connectivity
- Wind Farms On-and Off-shore Reduces Installation Time with TE Connectivity’s New Easy-to-use High Voltage Joints (PHVJ)
- TE Connectivity Acquires Smart Grid Company Kries, Expanding TE’s Smart Grid Monitoring, Protection, Automation Capabilities
- TE Connectivity and Sekorm Reached A Strategic Cooperation on the Connector Business
- TE Connectivity‘s Raychem USB 3.1 cable provides up to 10 Gb/s data rates and Jacket elongation of 200% minimum
- TE Connectivity Acquires ERNI Group AG
- TE Connectivity Launches First-to-market SolderSleeve Device for Space
- TE Connectivity begins expansion of ERNI facility in Germany
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
