RH850/F1L, R1L series: Changed from implementation of PKG Burn-in to alternative Burn-in in the test flow(LLWEB-20105516)
2021-04-07
●Subject: Change the following for RH850/F1L, R1L series. Changed from implementation of PKG Burn-in to alternative Burn-in in the test flow.
●Description of Change: RENESAS plans to change the burn-in process to secure a stable supply of RH850/F1L, R1L series products. Please approve the following changes.
■Wafer Process: NAKA
■Assy Process: RSC, Nishiki, ASE-KH
■Target Products: RH850/F1L, R1L series
●Summary of changes:
■Item: Test flow Change (Burn-in process)
■New: Alternative Burn-in Implemented
■Current: Implementation of PKG Burn-In
●Description of Change: RENESAS plans to change the burn-in process to secure a stable supply of RH850/F1L, R1L series products. Please approve the following changes.
■Wafer Process: NAKA
■Assy Process: RSC, Nishiki, ASE-KH
■Target Products: RH850/F1L, R1L series
●Summary of changes:
■Item: Test flow Change (Burn-in process)
■New: Alternative Burn-in Implemented
■Current: Implementation of PKG Burn-In
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