Impact™ Backplane Connector System
TE Connectivity offers a variety of backplane/midplane solutions to meet the demand for increased network bandwidth and advanced technology. Each solution is designed for high performance, increased density and compatibility with industry standard interfaces.
TE provides a user-friendly transition between the PCB-mounted connector and the backplane/ midplane.TE has extensive knowledge and expertise on high-speed interface design. Your specific needs can be customized and transformed into new manufacturable designs.
The Impact backplane connector and cable system from TE pushes the speed and density envelope to meet the growing demands of next generation telecom-munication and data networking equipment; the system is available in 2-6 pair configurations with a complete range of guidance and power-solution options plus right-angle cable assemblies.
The Impact system is available in two compliant-pin design options on both daughter card and back-plane connectors, providing customers ultimate flexibility to optimize their designs for advanced mechanical and electrical performance. The Impact system's mating interface provides in-line staggered, bifurcated con-tacts that provide 2 points of contact for the long-term reliability performance and built-in, ground-signal sequencing. This reduces the average mating force per connector to improve the mechanical mating performance of the system
Selection catalogue
- +1 Like
- Add to Favorites
Recommend
- TE Connectivity to acquire antennas business from Laird Connectivity
- Wind Farms On-and Off-shore Reduces Installation Time with TE Connectivity’s New Easy-to-use High Voltage Joints (PHVJ)
- TE Connectivity Acquires Smart Grid Company Kries, Expanding TE’s Smart Grid Monitoring, Protection, Automation Capabilities
- TE Connectivity and Sekorm Reached A Strategic Cooperation on the Connector Business
- TE Connectivity‘s Raychem USB 3.1 cable provides up to 10 Gb/s data rates and Jacket elongation of 200% minimum
- TE Connectivity Acquires ERNI Group AG
- TE Connectivity Launches First-to-market SolderSleeve Device for Space
- TE Connectivity begins expansion of ERNI facility in Germany
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.