Tputty 502 Thermal Reliability Report

2020-11-26
The Laird Technologies’gap filler reliability test procedure has been designed to characterize the long-term performance of a gap pad while being subjected to isothermal conditions,repeated extremes in temperature, and moderate heat -high humidity environments. Specimens are placed within application-related fixtures under set conditions and at regular intervals the thermal properties of the specimens are measured.

Laird

Tputty 502Tputty 502-20milTputty 502-40milTputty 502-200mil

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Test Report

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4/26/2018

Rev A

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