Tputty 508 Thermal Reliability

2020-11-24
This report summarizes the thermal reliability testing of Tputty 508. The Laird reliability test procdure is designed to characterize the long term performance of the thermal putty by subjecting the material and test fixture to isothermal conditions, repeated thermal shock conditions, and moderate heat and high humidity conditions. This is an interim report which covers the isothermal bake and shock conditions.

Laird

Tputty 508

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Test Report

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11/14/2019

Rev B

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