EPC2204 Thermal Model
•A power dissipation of 1 W in the device active area is assumed.
•Finite element analysis (FEA) thermal simulations
•R-ΘJB and R-ΘJC are obtained by stationary simulations.
•Z-ΘJB and Z-ΘJC are obtained by transient simulations.
•R-C thermal model is generated.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2020/09/25 |
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846 KB |
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