EPC2102 – Enhancement-Mode GaN Power Transistor Half-Bridge

2020-10-09
Gallium Nitride's exceptionally high electron mobility and low temperature coefficient allows very low R-DS(on), while its lateral device structure and majority carrier diode provide exceptionally low Q-G and zero Q-RR. The end result is a device that can handle tasks where very high switching frequency, and low on-time are beneficial as well as those where on-state losses dominate. EPC2102 eGaN® ICs are supplied only inpassivated die form with solder bumps Die Size: 6.05 mm x 2.3 mm.
Benefits:
•High Frequency Operation
•Ultra High Efficiency
•High Density Footprint

EPC

EPC2102

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Part#

Enhancement-Mode GaN Power Transistor

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High Frequency DC-DC ]

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Datasheet

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June, 2020

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