Thermal Model of 1:1 Extra-Large Half-Bridge Products EPC2102, EPC2103, and EPC2104 Efficient Power Conversion Corporation

2022-03-30

●The thermal model applies to 1:1 half-bridge products including EPC2102, EPC2103, and EPC2104.
●Equal power density of Q1 and Q2 and a total power dissipation of 1 W in the device active area is assumed.
●R-ΘJB and R-ΘJC are obtained by static steady simulations.
●Z-ΘJB and Z-ΘJC are obtained by transient simulations. SPICE thermal model of RC network is generated

EPC

EPC2102EPC2103EPC2104

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Part#

eGaN FET

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Technical Documentation

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2019/05/05

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