【PCN】Renesas CU WIRE AND FACTORY CHANGE DIFFERENCE OF RL78_HWQFN PRODUCTS (MCP-AB-20-0061)
Overview
For RL78 microcomputer products, we continuously add manufacturing factories and change assembly materials for stable supply.
For HWQFN package products, manufacturing factories and assembly materials also are changed this time.
Outline
1) Material: Standard materials are used in new factory
1-1) Bonding wire change to Copper (Cu)
1-2) Lead frame, Die mount material and Mold resin material change
2) Factory
2-1) Assembly factory
Current factory: Amkor Technology Japan Kumamoto/Hakodate (ATJ Kumamoto/ ATJ Hakodate)
New factory: Powertech Technology Inc., Group_Greatek Electronics Inc. (PTI_Greatek)
2-2) Sorting factory:
Current factory: Amkor Technology Japan Kumamoto (ATJ Kumamoto)
New factory: King Yuan Electronics Co., Ltd (KYEC)
3) Package outline:
There are changes in some of dimensions
The package surface becomes matte but does not affect the reliability
4) Marking on package
4-1) Font change
4-2) Manufacturing lot number change (from 9 digit to 7 digit)
4-3) Delete country of origin indication
5) Packaging material:
5-1) Tray and the order of devices change
5-2) Addition of bundling band color (Black)
5-3) Emboss tape change
5-4) Reel for emboss taping change
6) Storage condition after opening:
Current product: Amkor Technology Japan: Within 30°C/ 70%RH/ 168h
New product: Powertech Technology Inc., Group: Within 30°C/ 60%RH/ 168h (JEDEC compliant)
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