Single-Chip IEEE 802.11™ a/b/g/n MAC/Baseband/Radio with Integrated SDIO and USB Interfaces
|
|
|
|
|
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
April 2, 2014 |
|
|
Revision4319CT-DSXX3-RI |
|
|
|
|
|
2.4 MB |
- +1 Like
- Add to Favorites
Recommend
- Alliance Memory Offered Discontinued Cypress Semiconductor CY62256 Low Power SRAMs With Original Part Numbers Into 2019
- Vincotech‘s flowNPC 0 ＆ 1 with Infineon TRENCHSTOP™ IGBT5 - Higher Performance, Lower Spend
- BOYD Develops a Cooling Solution for Infineon Power Module Family, HybridPACK™ DSC for Hybrid and Electric Vehicles
- II-VI Incorporated Signs Multi-Year Contract to Supply Infineon with Silicon Carbide Substrates for Power Electronics
- Infineon Continues to Partner with Boyd to Develop Improved Systems and Solutions for Cooling Electronics in HEV/EV
- Alliance Memory Offers Readily Available AS6C62256 Low-Power SRAM Drop-In Replacements for CY62256
- Vincotech flowBOOST 1 sym - Featuring Infineon TRENCHSTOP™ IGBT5 Chips and Designed for 100A and 150A
- Fujitsu Component Launches Bluetooth 5.0 Dual Mode Wireless Modules FWM7BTZ61 Series
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
