Temperature Rise Estimations in Rogers High Frequency Circuit Boards Carrying Direct or RF Current
●Frequently, designers are concerned about temperature rise of the conductor traces on devices built in microstrip or stripline confi gurations on RT/duroid® microwave material. The question arises when there are high bias line currents, but the bias line needs to be as narrow as possible to keep its characteristic impedance high. It also is of concern when RF power levels are high.
●The following calculations may be used to give a conservative approximate answer to these concerns. It should be noted that these formulas are considerably simpler than a rigorous treatment of the subject. The estimates will be conservative, since the simplifying assumptions (except possibly the fourth) tend to yield higher values than a rigorous computation would yield.
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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061517 |
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92-332 |
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103 KB |
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