Keeping high-frequency circuitsnoise-free
●Thanks to its advanced high-precision multilayer technology TDK-EPC has developed extremely compact 0402 and 0603 series of multilayer chip inductors with high Q values.
●The new MLG0402Q and MLG0603P series from TDK are designed for use in the high-frequency circuits and modules of mobile phones.
●As mobile handsets continue to shrink in size they are simultaneously offering an increasingly complex array of functions. This raises the requirements both for miniaturization and performance on all components used, including inductors. In particular, the multilayer chip inductors therefore also need to be made even smaller in size while providing high Q ratings. TDK-EPC was able to meet these demands by further refining the process technology for low temperature co-fired ceramic (LTCC) multilayer substrates.
●The manufacturing process for the newly designed internal electrodes of the chip now features even more accurate position control. The result is the MLG0402Q and MLG0603P series of multilayer chip inductors in 0402 and 0603packages with high Q values. Multilayer chip inductors are manufactured using thin sheets made of ferrite or other materials on which coil patterns are printed with metallic paste (normally silver). By arranging these sheets in multiple layers, a spiral-shaped internal electrode pattern is created. The multilayer technique developed by TDK allows the coil to be formed without the need to wind wire on a core, facilitating both miniaturization and mass production.
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[ high-frequency circuits ][ high-frequency modules ][ mobile phones ][ SAW filters ][ VCO circuits ][ chokes ][ Bluetooth ][ WLAN ][ UWB ][ digital TV tuners ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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March 2011 |
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1.8 MB |
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