Z-PACK TinMan High Speed, High Density Backplane Connector
The Z-PACK TinMan backplane connector family is a cost-effective solution for customers searching for a high density,high performance backplane interconnect system.
The Z-PACK TinMan connector design follows proven industry backplane convention by offering a fully protected right-angle receptacle for use on daughtefcards where handling damage can be a concern when mating to a vertical male header. This connector permits field repairability at either the module or single pin levels.
Ground contacts positioned within each column of the connector, combined with unique contact lead frame arrangements, enable the Z-PACK TinMan connector to achieve low crosstalk and high through-put performance levels.Reliability is provided with a dual point of contact mating interface and compliant pin interface to the printed circuit board.
Selection catalogue
- High Speed Backplane Connectors Introduction
- Right Angle Receptacle Assemblies
- 4 Pair Vertical Receptacle Assemblies
- 6 Pair Vertical Header Assemblies
- 5 Pair Vertical Header Assemblies
- 4 Pair Vertical Header Assemblies
- 3 Pair Vertical Header Assemblies
- Right Angle Pin Header Assemblies
- Z-PACK TinMan Midplane Connector Overview
- Z-PACK TinMan Orthogonal 6 Pair Midplane Assemblies
- Z-PACK TinMan Product Mating Sequence Chart
- Z-PACK Slim UHD Connectors
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