THERMFLOW™ T725 Phase-Change Material TEST REPORT
●Thermal Performance vs. Contact Pressure：
■ASTM D5470 test procedure was performed to determine the thermal performance of Chomerics’ THERMFLOW T725 material versus the amount of contact pressure applied. The T725 material tested was batch number 2969, manufactured on October 22nd, 1999, from roll #4. As expected, increasing the contact pressure results in improved thermal transfer. The lack of a fiberglass carrier allows the T725 material to have as thin a bond line as possible.
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Test Report |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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CHO-TRT725 |
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76 KB |
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