Reliability Qualification Report for Mobile LPSDRAM with Pb/Halogen Free (16M×16, 63nm SDRAM AS4C16M16MSA-6BIN)

PublishTime：2022-03-28

●Product：256Mb Mobile LPSDRAM
●Device: AS4C16M16MSA-6BIN
●Technology: 63nm
●Function: 16M*16 LPSDRAM
●Package Type: 54B FBGA
●Substrate: BT
●Solder Ball: Sn-Ag-Cu Ni solder ball
●Molding Compound: Kyocera G1250
●Package Size: 8*9 mm²

Brand of Product：	Alliance
Part#：	AS4C16M16MSA-6BIN More Part#
Product Category：	Mobile LPSDRAM 、 SDRAM More
Application：	More
Data Type：	Test Report More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	FBGA
Language：	English Chinese Chinese and English Japanese
Date of Creation：	March. 2019
Version Number：
Data Encoding：
Data Size：	1.5 MB

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