AS4C16M16MD1-6BCN ALLIANCE MEMORY MDS REPORT
●Device:AS4C16M16MD1-6BCN
●Package : 8 x 9mm60FBGA
●Weight (mg) : 110.491
●Material:Silicon Chip、Encapsulation (Mold Compound)、Substrate、Die Attach (Adhesive)、Gold Wire、Solder Ball
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Test Report |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2017. 03. 06 |
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378 KB |
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