AS4C128M16D3B-12BCN 30nm 2Gb DDRIII SDRAM Product Qualification Report
●Information
■Product：2Gb DDRIII SDRAM
■Device：AS4C128M16D3B-12BCN
■Technology：30nm
■Function：128M*16 DDRIII
■Package Type：96B FBGA
■Substrate：BT
■Solder Ball：Sn-Ag-Cu solder ball
■Molding Compound：HITACHI CEL-9120HF
■Package Size：8*13 mm²
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Test Report |
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Please see the document for details |
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FBGA |
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English Chinese Chinese and English Japanese |
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2019/04/29 |
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2.2 MB |
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