MICRO SFP+ CONNECTOR & CABLE ASSEMBLY
●TE Connectivity’s (TE) micro SFP+ connector and cable assembly empower you to dream big when designing your communication system. Through a footprint that’s up to 50% smaller than current SFP+ interconnects, the micro SFP+ interconnects allow you to increase faceplate density while freeing up ad-ditional PCB space due to the board connector’s shortened length. The products’ designs have also been enhanced to improve signal routing, minimize EMI and optimize automated manufacturing processes.
■Increases Faceplate Density / Saves PCB Space: micro SFP+ is up to 50% smaller than current SFP+ connectors, in width and length, taking up as little as 15mm board space. One micro SFP+ frees up 19% more faceplate space than 1 SFP+ connector.
■Improves Signal Integrity: The cable assembly and connector were designed with a staggered contact configuration that improves signal routing. Additionally, the bottom and top contacts have been further optimized for speed.
■Reduces EMI: EMI is minimized through a die cast housing, cable shield crimped at 360 degrees, and an extended EMI shield over the cable’s plug.
■Optimizes Manufacturing Processes: For manufacturing automation, the board interconnect combines the connector & cage into one finished product for automated of board placement. High temperature pin in paste soldering can be achieved as the product withstands up to 265 degrees Celsius.
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[ Telecommunications ][ Cellular infrastructure ][ hubs servers ][ switches ][ Data communication ][ servers ][ storage equipment ][ Medical diagnostic equipment ][ Networking ][ Network interface ][ storage ][ power supplies ][ test equipment ][ measurement equipment ] |
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Supplier and Product Introduction |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2017/02/17 |
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1.6 MB |
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