Shenzhen Dianyang Technology Co.,Ltd engaged in ELEXCON Tradeshow, Showing CA Pro Series Thermal Camera

2023-01-18 DYT News

From the 6th to the 8th of November 2022, the 6th ELEXCON Expo (Shenzhen International Electronics Exhibition) was held at Shenzhen Futian Convention and Exhibition Center. The Expo focuses on four core sectors including "5G new technologies and applications, automotive-grade new products and components, embedded AIoT, SiP, and advanced packaging", bringing together 400+ renowned manufacturers across the world to witness new products, new models, and new technology in the electronics industry.

Shenzhen Dianyang Technology Co., Ltd(DYT) fully exhibited the company's brand DytSpectrumOwl's CA Pro series thermal camera analyzers and demonstrated to customers on spot the use of infrared thermal imaging principles to detect and measure the data of object‘s surface temperature changes with time, and the measurement results can be analyzed indefinitely and provide comprehensive reliability analysis.



Since its inception, Shenzhen Dianyang Technology has always keeps committed to the R&D and innovation of the core technology of infrared thermal imaging products. The products have a wide range of applications, such as the following:

Automobile industry: the thermal cameras can help automotive engineers improve the design of airbag systems, verify the efficiency of heating and cooling systems, quantify the effect of thermal shock on tire wear, and inspect the performance of joints and welds.

 

Electricity industry: at present, the electricity industry is the one with the most applications for thermal imaging cameras. As a mature and effective means of online power detection, thermal imaging cameras can greatly improve the reliability of power supply equipment.

 

Manufacturing industry: as electronic components get smaller and smaller, it becomes extremely difficult to accurately understand their thermal status. But with a thermal camera, engineers can easily visualize and quantify thermal imaging of devices. When combined with infrared thermal imaging technology, the microscope becomes a thermal imaging microscope that can accurately measure the temperature of objects as small as 3um. Engineers can use a thermal camera to map the heat of components and semiconductor substrates performance.

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