Nippon Chemi-Con Added PMA Series Resin-Molded Chip Type Conductive Polymer Aluminum Solid Capacitors With a Low Profile of 3.0mm
Nippon Chemi-Con has added 3.0mm max. low-profile products to the Resin-Molded Chip Type Conductive Polymer Aluminum Solid Capacitors PMA Series.
Nippon Chemi-Con has reviewed the conventional structure in which the element is sealed with an aluminum case and sealing rubber and developed a unique technology to seal the element with resin mold instead. The technology has already been commercialized as the PMA Series.
The case size of existing products is 7x7x3.5 mm max. However, Nippon Chemi-Con has succeeded in further reducing the height to 3.0mm max. By newly reviewing the terminal structure and resin, Nippon Chemi-Con has reduced the height while maintaining the same performance and reliability as 3.5mm max. products. As a result, this product can be mounted on even smaller and thinner devices.
Samples of the 3.0mm max. product has been available since April this year, and mass production is scheduled to begin this October.
Nippon Chemi-Con continues to work on the development of high-capacitance products, 35V products (currently up to 25V), and products guaranteeing moisture-resistance at 85℃ 85%RH to expand the variation of the resin-molded chip type PMA Series.
[Main Specifications]
- Category temperature range: -55℃ to +105℃
- Rated voltage range: 6.3V to 25V
- Capacitance range: 22 to 220µF
- Endurance: guarantees 5,000 hours at 105℃; guarantees 500 hours at 65℃ 95%RH
- Equivalent series resistance (ESR): 35 to 50mΩ
- Allowable ripple current: 2000 to 2300 mArms
- Case size: 7x7x3.0mm Max
[Samples and Mass Production]
Samples: April 2016
Mass production: October 2016
[Production Site]
Chemi-Con Yonezawa Corp.
[Product Appearance]
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