In the field of wireless communication, Bluetooth Low Energy (BLE) modules have become one of the mainstream technologies for short-range wireless communication due to their core advantages such as low power consumption, high cost-effectiveness, ease of deployment, and fast networking. With its flexible topology and mature protocol stack design, BLE is widely used in consumer electronics, smart homes, wearable devices, healthcare, industrial IoT (IIoT), asset tracking, and other fields. It provides stable and efficient connectivity solutions for various IoT terminals, making it one of the dominant wireless communication technologies.
Recently, DreamLNK's DL-PAN1070-AM BLE Module has been officially released, this Module is a low-power SoC Bluetooth Module based on the Chinese brand PAN1070 chip. It integrates advanced dual-mode RF supporting both Bluetooth LE 5.3 and a 2.4G proprietary protocol. Delivering mid-to-high-end performance, exceptional cost-effectiveness, and fine craftsmanship, it provides a stable, efficient, and flexible wireless connectivity solution for short-range Internet of Things (IoT) applications. This module is an ideal choice for smart homes, wearable devices, industrial IoT, asset tracking, and more.
Core Advantages
Cost-Effective Solution: Utilizes the domestic PAN1070 chip, ensuring a self-controllable supply chain with costs over 30% lower than imported alternatives.
Dual-Mode Flexible Connectivity: Simultaneously supports BLE 5.3 and 2.4G proprietary protocol, enabling seamless switching between different devices (phones, PCs, remotes) for broader application scenarios.
Ultra-Low Power Design: Features a deep sleep current as low as 5μA, combined with multiple low-power modes, significantly extending battery life for powered devices.
Strong RF Performance: High receiving sensitivity of -99dBm, maximum transmit power of up to +9dBm, and an enhanced transmission distance of up to 100 meters with strong anti-interference capabilities in complex environments.
Master-Slave Multi-Connection: Supports multiple roles including Master, Slave, and Master-Slave Integration (concurrent roles), allowing simultaneous connections and management of multiple devices for flexible networking and simplified system design.
Development Friendly: Offers abundant GPIOs and interfaces, supports Keil MDK development environment, and comes with a mature SDK and examples, greatly reducing product development time.
Technical Specifications
Core IC: PAN1070 (Cortex-M0+ Core, 48MHz)
Wireless Standard: Bluetooth Low Energy 5.3 + 2.4G Proprietary Protocol
Memory: 512KB Flash + 48KB SRAM
Interfaces: GPIO (Up To 19), UART, SPI, I2C
Supply Voltage: 1.8V ~ 3.6V
Operating Temp.: -40℃ ~ +85℃
Power Consumption:
Tx: 8mA @ 0dBm
Rx: 2.5mA
Standby: 0.3μA
Sleep: 5μA
RF Performance:
Sensitivity: -99dBm (BLE 1Mbps)
Tx Power: -20 ~ +9 dBm (adjustable)
Range: Up to 100m (line-of-sight)
Frequency Band: 2.400 - 2.483 GHz (Global ISM Band)
Development Env.: Keil MDK (Recommended v5.25-v5.36), J-Link SWD Debug, Python3.8+
Key Features
1. Master-Slave Multi-Connection (Multi-Role & Connection)
Master Mode: Actively scans and connects to peripheral Slave devices, can manage multiple connections (like a "Customer").
Slave Mode: Advertises itself and accepts connections from Master devices (like a "Server").
Master-Slave Integration Mode (concurrent roles): Can dynamically switch between Master and Slave roles. It can connect to a phone (as Slave) and sensors (as Master) simultaneously, greatly enhancing networking flexibility. It's the preferred choice for smart home relay devices.
2. Dual-Mode Operation (BLE 5.3 + 2.4G)
BLE 5.3: Supports multiple PHY rates (1M, 2M, 500k, 125kbps), compatible with the vast ecosystem of smartphones and tablets.
2.4G Proprietary Protocol: Supports rates (1M, 2M, 500k, 250k, 125kbps) with hardware ACK, offering low latency and high reliability, suitable for dedicated remotes, keyboard/mouse combos, and other scenarios requiring high real-time performance.
Application Value: A single module can cater to different connection targets (e.g., using 2.4G dongle for PC/TV, BLE for phone App), enabling true "one-chip-multiple-connections".
3. Bluetooth Mesh Networking Support
Supports SigMesh protocol, featuring Friend, Low Power, Proxy, and Relay node functionalities.
Enables the construction of large-scale, highly stable device networks, suitable for building automation, whole-house smart lighting, sensor networks, and other applications requiring coordination among thousands of devices.
Applications
Smart Home: Smart locks, Mesh lighting systems, appliance control, smart plugs, environmental sensors, smart printing devices.
Wearables & Medical: Smartwatches/wristbands, medical devices (glucose meters, blood pressure monitors), VR/AR controllers, TWS earphone charging cases.
Asset Tracking & Location: Bluetooth Beacons, indoor navigation, asset tracking tags, item finders.
Industrial IoT (IIoT): Industrial sensors, wireless HMI panels, PLC wireless communication, smart warehousing, wireless meter reading.
New Retail & Consumer Electronics: Electronic Shelf Labels (ESL), sharing economy devices (bikes, power banks), remotes, gaming peripherals.
Conclusion
The DL-PAN1070-AM RF module achieves an outstanding balance of performance, cost, and flexibility through its domestic chip, dual-mode connectivity, ultra-low power consumption, and powerful master-slave capabilities. It not only meets the various connectivity needs of current IoT devices but also provides a solid technical foundation for products to adapt to future market changes. It is an excellent core module choice for developers creating the next generation of wireless smart products.
