Introducing Kyocera‘s Small and Thin MLCCs for Semiconductor Applications and Operable at 105℃
KYOCERA has developed a lineup of small and thin products operable at the high-demand 105℃ temperature limit.
Overview
In recent years, due to heat generation around the processor die and PMIC, the demand for high-temperature operable has increased from 85℃ to 105℃.
Kyocera has a wide range of small MLCC products, from EIA0201 size 1μF to EIA0805 size 100μF.
A new addition to the product lineup is the thin 2.2μF capacitor, EIA0503 size (1.15×0.65mm), which can be mounted in BGA gaps of thickness 0.22mm or less.
Keywords
What is a processor?
This is a general term for processing equipment and generally refers to a CPU.
What is die?
Each chip is a pattern of wires and elements baked into a silicon wafer and diced.
What is PMIC?
It stands for "Power Management IC," and it combines multiple DC/DC converters and power control functions. It means an IC that can perform power management.
What is BGA?
BGA is a type of semiconductor package consisting of a grid of small ball-shaped solders. It is short for Ball Grid Array.
Features
Suitable for High-temperature Environments (up to 105℃)
Compatible with high-temperature environments due to heat generation, such as near processor dies and PMICs.
Wide Range of Lineups
Kyocera has a wide lineup, from 1μF (EIA0201 size) to 100μF (EIA0805 size).
Thin Series of 0.22mm or Less
Kyocera will develop thin series of 0.22mm or less, which can be mounted in the gap of BGA.
Applications
The semiconductor periphery and the back surface of the package board.
Product Lineup
General Use
Thin MLCCs Series 0.22mm or Less
Products highlighted yellow are available for mass production.
Products highlighted green are under development.
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