Samples of Low Noise SiC Power Modules MG074 from Shindengen Are Now Available
Shindengen Electric Manufacturing will begin sample shipments of the MG074 SiC power module for consumer and industrial applications.
Applications such as full-bridge converters and bridgeless PFC in the consumer and industrial equipment markets require high-efficiency, low-loss power devices from an energy-saving perspective. In order to reduce switching losses in such power devices, conventional Si devices are being replaced by SiC devices that can operate at high speeds. However, surge voltages generated during high-speed operation cause noise and ringing, and measures to address this issue have become a challenge.
Shindengen has developed the MG074 low noise SiC power modules to solve this problem. This product uses a newly developed package to maximize the performance of the on-board SiC MOSFETs. The internal structure is designed with a symmetrical layout and equal wiring lengths to minimize the difference in surge voltage generated in the current path. In addition, by changing the layout of terminals and patterns inside the module, stray inductance has been reduced by 66% compared to the case where two discrete products※1 are used. This contributes to lower noise in equipment.
Furthermore, this product reduces thermal interference by distributing semiconductor elements to achieve higher performance and reliability of the equipment.
※1 Comparison with "TO-247 4pin"
Features
1. Low-noise performance
Our proprietary package technology reduces stray inductance and suppresses noise.
①Stray inductance has been reduced
Stray inductance has been reduced by 66% compared to the case where two discrete products※1 are used, contributing to the suppression of surge voltage.
※1 Comparison with "TO-247 4pin"
②Symmetrical layout
The internal structure is designed with a symmetrical layout and equal wiring lengths to minimize the difference in surge voltage generated in the current path.
2. this product reduces thermal interference
Distributed placement of semiconductor elements, which are heat sources, suppresses temperature rise due to heat interference.
Typical Applications
Bridgeless PFC circuit for consumer equipment
Full bridge converter for industrial equipment
Specifications
Factory location
Akita Shindengen, Co., Ltd. etc.
Availability
Scheduled for Winter 2025
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