Feasycom‘s LE Audio Solution Shines at EXPO COMM Wireless Japan 2024

PublishTime： 2024-06-27 Article Source：FEASYCOM Official Website

FEASYCOM’s Japanese distributor, ASNICS, recently showcased Feasycom's innovative wireless modules and solutions at EXPO COMM Wireless Japan, one of the largest wireless communication trade shows in Tokyo.

Wireless Japan: A Premier Event for Wireless Communication Technology

Wireless Japan is a premier event in the wireless communication sector, featuring the latest advancements and innovations in wireless technology. The exhibition provides a platform for companies to present their newest products and solutions, network with industry peers, and gain insights into the latest trends and developments. This year’s event attracted a diverse audience of over 30,000 attendees, including industry leaders, researchers, and technology aficionados. The exhibition covered a wide range of topics, from 5G and IoT to Bluetooth and WiFi technologies, making it a focal point for anyone interested in the future of wireless communication.

Highlight: LE Audio Solution

Among the various products on display, Feasycom's LE Audio solutions stood out, garnering considerable interest from visitors. LE Audio represents a revolutionary advancement in the audio field, offering superior audio quality, lower power consumption, and reduced latency through the use of LC3 encoding. One of the most notable features of Feasycom's LE Audio modules is their support for Auracast, which allows a single audio transmitting device to connect to multiple audio receiving devices simultaneously. This feature addresses common issues in wireless headphones and Bluetooth speakers, providing a seamless and enhanced user experience.

Many visitors were eager to learn more about the capabilities and applications of these modules, leading to numerous on-the-spot demonstrations and discussions. The overwhelming response was evident as many customers filled out intention collection forms, expressing their interest in incorporating Feasycom’s LE Audio solutions into their products and systems.

Feasycom's LE Audio Modules

FSC-BT631D
FSC-BT631D is designed for advanced wireless audio products, utilizing Nordic Semiconductor's nRF5340 SoC. Key features include support for both LE Audio and Bluetooth Classic, ultra-high audio quality with LC3 encoding, and low power consumption. It also enables Auracast broadcast audio, allowing a single device to connect multiple receivers.

FSC-BT6038A

FSC-BT6038A is a dual-mode Bluetooth 5.4 LE audio module based on Qualcomm's QCC3086 chipset. It features Qualcomm aptX and aptX HD audio for high-quality sound, a 240 MHz audio DSP, and a flexible QSPI flash programmable platform. It is designed for USB dongles, earbuds, and speakers, providing exceptional wireless audio performance for various applications.

FSC-BT1038A

FSC-BT1038A is a cutting-edge Bluetooth 5.4 LE audio module, powered by the Qualcomm QCC3083 chipset. Key features include aptX, aptX HD, aptX Lossless, and aptX Adaptive for superior audio quality, and multiple digital interfaces like I²S, PCM, and USB. It's ideal for applications such as wireless speakers, headphones, and automotive audio systems.

Looking Ahead: Future Collaborations

Feasycom extends our gratitude to ASNICS for their excellent partnership and support during the Wireless Japan exhibition. Looking to the future, Feasycom is excited about the potential for further collaboration with ASNICS. Together, we aim to continue exploring new opportunities and pushing the boundaries of wireless communication technology, delivering innovative solutions that meet the evolving needs of our customers.

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