What Is The Difference between MBR20100FCT and MBR20100CT
What is the difference between Schottky diode MBR20100CT and Schottky diode MBR20100CT? Before discussing their differences, let's take a look at their parameter specifications together and make a simple comparison:
MBR20100FCT, average forward rectified current 20A, reverse withstand voltage 100V, forward voltage drop 0.75V, reverse leakage current 10μA, forward repetitive peak surge current 300A, packaged ITO-220AB; MBR20100CT, average forward rectified current 20A, reverse withstand voltage 100V, forward voltage drop 0.75V, reverse leakage current 10μA, forward repetitive peak surge current 300A, packaged TO-220AB. The picture is as follows
Fig.1
As shown in the above figure, the difference between Schottky diode MBR20100FCT and MBR20100CT is that MBR20100FCT is fully encapsulated, while MBR20100CT is semi-encapsulated. And there is no difference in parameter specifications and foot positions between the two, so why design these two different packaging methods? Or rather, what is the purpose of designing these two packaging methods? Speaking of which, we have to mention a very important issue in the use of electronic products - heat dissipation!
One of the reasons why Schottky designed these two methods is also this. Behind the semi plastic packaging is an iron sheet. As we all know, the thermal conductivity of iron is very good, so the semi plastic design is mainly to solve the problem of heat dissipation. So here's the problem! Wrapped with black glue outside the fully plastic packaging, it's not like it's reversed and won't have the effect of heat dissipation. Of course not. In a well ventilated environment, we need to consider another issue - insulation. The black glue wrapping outside greatly improves the insulation of Schottky diodes, preventing leakage caused by humid air and posing a threat to people or electronic products. We hope the above content will be helpful for everyone in how to choose Schottky diode packaging in the future.
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