SMART Introduces Zefr ZDIMM Memory Modules with Ultra-High Reliability for Demanding Compute Applications
NEWARK, Calif., Mar. 26, 2024 — SMART Modular Technologies, Inc. (“SMART”), a division of SGH (Nasdaq: SGH) and a global leader in memory solutions, solid-state drives, and hybrid storage products, introduces its ultra-high reliability memory solution, Zefr™ ZDIMM™ memory modules. ZDIMM modules are ideally suited for data centers, hyperscalers, high performance computing (HPC) platforms and other environments that run large memory applications that demand maximum availability of the compute platform. Memory reliability is a critical factor in data centers due to the high costs associated with downtime. ZDIMM modules are offered in both DDR4-3200 and DDR5-5600 form factors and are available in mainstream densities.
ZDIMM modules employ SMART’s proprietary Zefr screening process that delivers the highest levels of uptime and reliability, typically performing 90% better than industry standard memory modules. ZDIMM modules undergo a screening process that replicates real-world conditions which ensures the robustness and resilience of ZDIMM Memory Modules in the most demanding computing scenarios.
”The industry standard for defective parts per million, or DPPM, for DRAM modules is in the 3,000 to 5,000 range,” explains Tom Quinn, SMART’s senior vice president of business development. “Typical Zefr ZDIMM module DPPM ranges from 200 to 300. This ultra-high reliability is valuable in critical data processing environments where uptime is paramount and downtime costs can quickly escalate.”
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