Variable Interface Adapter from IMS: A 5G RF Board-to-Board Solution
IMS's VIA® (Variable Interface Adapter) is designed for board-to-board and board-to-filter RF interconnections in today's and future 5G applications. The enhancement of the mechanical design is outstanding: limited detent and smooth bore interfaces are integrated into the adapter – one side of the adapter has mechanical retention to provide limited detent and the other side is smooth bore. The same PCB type could be used on both sides of the connection. For IMS customers, this results in a lower number of different parts on the BOM and lower costs.
The VIA® series is characterized by several key features among superior RF performance up to 6GHz, as well as a wide axial of ±1 mm and radial misalignment of 4°.
Applications
The VIA® series has been developed primarily for applications like:
Radios and filters in Small Cells
Radios and filters in Macro Cells
Distributed Antenna Systems (DAS)
In-building antennas
Massive MIMO antennas
Antenna interconnection solutions
5G RF board-to-board
Product Features
Combines all the advantages of board-to-board connections (SMP, Longwipe-SMP, P-SMP)
Reliable, advanced & secure connection
Excellent blind mate – fast and safe assembling
The same PCB type on both PCB sides simplifies assembly and the BOM
A limited detent or smooth bore side defined by the adapter
Low mating profile with a minimum board-to-board distance of 12mm
Available as SMD & Thru-Hole component
Options for enhanced funnel:
PCB connector with pre-assembled enhanced funnel
Enhanced funnel which could be assembled by the customer optionally
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