STEVAL-IOM001V1 Data brief IO-Link master evaluation board based on L6360 equipped with ST morpho connectors for STM32 Nucleo
■ Description
● The STEVAL-IOM001V1 evaluation board is based on the L6360 lO-Link master transceiver with physical layer compliant with lO-Link v1.1 specification.
● Together with the STSW-IOM001 example code, it provides an affordable and easy-to-use solution for the development of IO-Link applications, letting you easily evaluate the communication features and robustness of the L6360.
● You can also perform evaluation of multiple ports industrial lO-Link master modules by connecting up to four STEVAL-IOM001V1 with few solder bridge modifications.
● The STEVAL-IOM001V1 interfaces with the STM32 Nucleo microcontroller via UART and GPIO pins and is compatible with the Arduino UNO R3 (optional configuration) and ST morpho (default configuration) connectors.
■ Features
● 10-Link master PHY based on L6360
● Interrupt diagnostics pin
● l2C and UART interface
● SPI (slave) interface
● 65 mA selectable (3.3 or 5.0 V) linear regulator
● CQ (push-pull) and L+ (high side) switches
● IQ additional IEC61131-2 type 1 digital input
● L+ and CQ overload and overheating protections with non-dissipative cut-off function
● QFN-26L (3.5x5x1 mm) package
● Operating voltage range from 18 to 32.5 V
● Additional high side switch for L+ heavy loads (IPS161H)
● LEDs for status and diagnostics
● Ground and Vcc wire break protections
● EMC compliance with IEC61000-4-2, IEC61000-4-3, IEC61000-4-5
● Equipped with ST morpho connectors
● CE certified
● RoHS and China RoHS compliant
|
STM32 、 L6360 、 STEVAL-IOM001V1 、 STM32Cube 、 STSW-IOM001 、 IPS161H |
|
|
|
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
June 2018 |
|
|
Rev 1 |
|
|
DB3632 |
|
|
612 KB |
- +1 Like
- Add to Favorites
Recommend
- Rosenberger and STMicroelectronics Cooperate to Develop a Unique High-Speed Contactless Connector Based on 60GHz Wireless Technology
- STMicroelectronics and Sierra Wireless Collaborate to Simplify and Accelerate Connected IoT Solutions Deployment
- MTA Announces Partnership with STMicroelectronics for Smart Tractor
- Eclipse Global Connectivity, Smiths Interconnect and ST Engineering IDirect Collaborate to Deliver a New Airborne ISR SATCOM Capability
- ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement
- G-NiceRF’s New LoRa Spread Spectrum Modulation SOC Wireless Module LoRa-STM32WLE5 with Built-in ARM and Industrial Grade Crystal Oscillator
- China Requires Automobile Manufacturers to Increase the Proportion of Domestic Chip Procurement
- Rosenberger‘s Innovative Contactless Connector RoProxCon can Bridge Construction-related Air Gaps and Has A High Interference Immunity
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
