Keysight Technologies Global Device Modeling Services

PublishTime： 2018-11-16 Manufacturer： Keysight Type： Technical Documentation Language： English

●Introduction
■Integrated Circuit (IC) design stands on the shoulders of device modeling and characterization. The semiconductor industry requires fast and accurate device models. Circuits are being pushed to higher frequencies as device geometries are becoming smaller with higher chip device count. Without adequate models, designers cannot accurately simulate their circuits. This leads to poor circuit performance on the lab bench. Some large companies designate entire groups to device characterization and model extraction. This requires measuring and deciphering mountains of data as semiconductor processes are fine-tuned. To overcome these challenges, combined expertise in the following areas are required.
●Low leakage DC measurements with pA accuracy
●Highly sensitive RF measurements to 100 GHz and beyond
●Wafer probing methodologies - RF, DC, probe card, etc.
●The latest advances in device models-BSIMCMG, HiSIM_HV, etc.
●Model extractions using IC-CAP or Model Builder Program
●Assure models will provide accurate results across multiple simulators
●Designing on-wafer test structures to expose process parameters
●Understanding and modeling the variation of device parameters within a process and across the wafer
●Model and predict device reliability
●Refining model libraries provided by foundries
●Comparing devices from different foundries using existing models
●Measurement automation software and data handling

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