Surface Mount ESD Capability Rectifiers SE30PAB, SE30PAD, SE30PAG, SE30PAJ

2022-06-07

●FEATURES
■Very low profile - typical height of 0.95 mm
■ Ideal for automated placement
■ Oxide planar chip junction
■ Low forward voltage drop, low leakage current
■ ESD capability
■ Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
■ Not recommended for PCB bottom side wave mounting
■ AEC-Q101 qualified

VISHAY

SE30PABSE30PADSE30PAGSE30PAJSE30PAJ-M3/ISE30PAJHM3/I

More

Part#

Surface Mount ESD Capability Rectifiers

More

commercial applications ]automotive applications ]

More

Datasheet

More

More

Please see the document for details

More

More

DO-221BC (SMPA)

English Chinese Chinese and English Japanese

04-Nov-16

Revision: 04-Nov-16

87702

233 KB

- The full preview is over. If you want to read the whole 5 page document,please Sign in/Register -
  • +1 Like
  • Add to Favorites

Recommend

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Contact Us

Email: