TG-S606C Thermal Compound
●Thermal Compound: TG-S606C is a silicone based thermal grease that has been designed for high performance CPUs and similar applications. It has a thermal conductivity of 5 W/mK, superior wetting characteristics, resulting in a very low thermal resistance and excellent long term reliability.
●Features:
■Good thermal conductivity
■Easy to assemble
■High stability
■Does not harden with time
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[ Electronic components ][ IC ][ CPU ][ MOS ][ LED ][ Heat Sink ][ LCD ][ TV ][ Notebook PC ][ PC Telecom Device ][ Wireless Hub ][ DDR II Module ][ DVD Applications ][ Hand-set applications ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018/04/15 |
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Version 1.280318 |
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558 KB |
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