L37-3 Thermal Conductive Pad
●Thermal Conductive Pad: L37-3 is a silicone based thermal interface pad which offers a good combination of high dielectric breakdown voltage, compliance and low thermal impedance. It contains a fibreglass mesh for enhanced ease of manufacture and is available in various formats such as standard sheets, log-rolls and custom die cut parts. L37-3 is available in a range of thicknesses and with one or two side thermally conductive adhesive preapplied.
●Features:
■Base materials are silicone with fibreglass
■One side with natural tack and another side with smooth surface
■Won’t be deformed when being pulled
■High dielectric breakdown voltage
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Thermal Conductive Pad 、 silicone based thermal interface pad |
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[ Electronic components ][ IC ][ CPU ][ MOS ][ LED ][ Heat Sink ][ LCD ][ TV ][ Notebook PC ][ PC Telecom Device ][ Wireless Hub ][ DDR II Module ][ DVD Applications ][ Hand-set applications ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018/04/15 |
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Version 1.280318 |
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712 KB |
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