S606 Thermal Compound
■Features
▲Good thermal conductivity
▲Easy to assemble
▲High stability
▲Does not harden with time
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[ Electronic components ][ IC ][ CPU ][ MOS ][ LED ][ M/B ][ P/S ][ Heat Sink ][ LCD-TV ][ Notebook PC ][ PC ][ Telecom Device ][ Wireless Hub ][ DDR II Module ][ DVD Applications ][ Hand-Set applications ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018/01/04 |
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422 KB |
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