STM32F410x8 STM32F410xB
●The STM32F410X8/B devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
●The STM32F410X8/B belong to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.
●The STM32F410X8/B incorporate high-speed embedded memories (up to 128 Kbytes of Flash memory, 32 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, one AHB bus and a 32-bit multi-AHB bus matrix.
●All devices offer one 12-bit ADC, one 12-bit DAC, a low-power RTC, three general-purpose 16-bit timers, one PWM timer for motor control, one general-purpose 32-bit timers and one 16-bit low-power timer. They also feature standard and advanced communication interfaces.
●Features
■Dynamic Efficiency Line with eBAM (enhanced Batch Acquisition Mode)
◆1.7 V to 3.6 V power supply
◆-40 °C to 85/105/125 °C temperature range
■Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
■Memories
◆Up to 128 Kbytes of Flash memory
◆512 bytes of OTP memory
◆32 Kbytes of SRAM
■Clock, reset and supply management
◆1.7 V to 3.6 V application supply and I/Os
◆POR, PDR, PVD and BOR
◆4-to-26 MHz crystal oscillator
◆Internal 16 MHz factory-trimmed RC
◆32 kHz oscillator for RTC with calibration
◆Internal 32 kHz RC with calibration
■Power consumption
◆Run: 89 µA/MHz (peripheral off)
◆Stop (Flash in Stop mode, fast wakeup time): 40 µA Typ @ 25 °C; 49 µA max @25 °C
◆Stop (Flash in Deep power down mode, slow wakeup time): down to 6 µA @ 25 °C; 14 µA max @25 °C
◆Standby: 2.4 µA @25 °C / 1.7 V without RTC; 12 µA @85 °C @1.7 V
◆VBAT supply for RTC: 1 µA @25 °C
■1×12-bit, 2.4 MSPS ADC: up to 16 channels
■1×12-bit D/A converter
■General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
■Up to 9 timers
◆One low-power timer (available in Stop mode)
◆One 16-bit advanced motor-control timer
◆Three 16-bit general purpose timers
◆One 32-bit timer up to 100 MHz with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
◆Two watchdog timers (independent window)
◆SysTick timer.
■Debug mode
◆Serial wire debug (SWD) & JTAG interfaces
◆Cortex® -M4 Embedded Trace Macrocell™
■Up to 50 I/O ports with interrupt capability
◆Up to 45 fast I/Os up to 100 MHz
◆Up to 49 5 V-tolerant I/Os
■Up to 9 communication interfaces
◆Up to 3x I2C interfaces (SMBus/PMBus) including 1x I2C Fast-mode at 1 MHz
◆Up to 3 USARTs (2 x 12.5 Mbit/s, 1 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
◆Up to 3 SPI/I2Ss (up to 50 Mbit/s SPI or I2S audio protocol)
■True random number generator
■CRC calculation unit
■96-bit unique ID
■RTC: subsecond accuracy, hardware calendar
■All packages are ECOPACK®2
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STM32F410x8 、 STM32F410xB 、 STM32F410T8 、 STM32F410C8 、 STM32F410R8 、 STM32F410TB 、 STM32F410CB 、 STM32F410RB 、 STM32F4 、 STM32 、 STM32F410T8Y 、 STM32F410TBY 、 STM32F410C8U 、 STM32F410CBU 、 STM32F410C8T 、 STM32F410CBT 、 STM32F410R8T 、 STM32F410RBT 、 STM32F410R8I 、 STM32F410RBI 、 STM32F42x 、 STM32F401 、 STM32F43x 、 STM32F41x 、 STM32F405 、 STM32F407 、 STM32F410CBY6TR |
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Datasheet |
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Please see the document for details |
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WLCSP36;LQFP48;LQFP64;UFQFPN48;UFBGA64 |
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English Chinese Chinese and English Japanese |
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December 2017 |
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Rev 6 |
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028094 |
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4.3 MB |
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