Waffle Pack Chip Carrier Handling/Opening Procedure
●ESD Awareness
■Skyworks deploys state of the art ESD controls from wafer fabrication through to assembly, test and pack. In order to maintain device integrity, Skyworks has outlined critical ESD guidelines that should be followed as a minimum. Skyworks adheres to the requirements out-lined in MIL-HDBK-263, MIL-STD-1686 and ESD Association 2.0 Handbook.
|
|
|
|
|
|
|
Application note & Design Guide |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
February 7, 2005 |
|
|
Rev. A |
|
|
200146 |
|
|
122 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
