MTEK Series - Legacy ATE System Upgrade Kit Keysight Technologies and Marvin Test Solutions
●Easily extend the life of your legacy semiconductor ATE with this low-cost, PXI-based, add-on solution
■Solve your semiconductor ATE system obsolescence problem
■Simply testing today's advanced semiconductor devices with yesterday's ATE is not an option. With each new development in device technology, the test requirements can outpace the capabilities of the available test equipment. Marvin Test Solutions' cost-effective, Marvin Test Expansion Kit (MTEK) platform provides the solution.
■The MTEK platform breathes new life into your legacy semiconductor test systems with a PXI-based, add-on solution that easily adds capability without the expense of replacing the entire test system.
■Part of Marvin Test Solutions' suite of semiconductor test solutions, ideal for engineering and production applications as well as incoming inspection and failure analysis, the MTEK Series is a flexible, scalable, test system upgrade for both wafer and packaged test.
■Combining Marvin Test Solutions' MTEK with Keysight Technologies' RF instrumentation, you can add the capabilities to address a wide range of RF and mixed-signal device testing requirements for both wafer and packaged test. The MTEK's open architecture can accommodate the full range of Keysight's RF PXI products, including vector signal generators, vector signal analyzers, and vector network analyzers, Marvin Test Solutions' extensive line of digital test products, as well as additional baseband instrumentation.
●Upgrade for legacy semiconductor test systems including Teradyne, LTX/Credence, and Verigy platforms
●Cost-effective PXI-based, add-on solution with an open architecture
●Easily add RF, digital, and analog performance
●Add the performance you need with Keysight's wide selection of RF instruments
●Fast implementation; the PXI chassis becomes an extension of the host CPU
●Simplified integration with existing test programs via DLL calls to the new instruments
●Easy integration with test floor data collection, data analysis, etc.
●Reduce time spent on training; little or no additional training for production personnel
●Multisite capability for both wafer sort and packaged test
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Please see the document for details |
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September 16, 2017 |
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5992-2552EN |
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496 KB |
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