Chip Silicon Rectifier EGFM301 THRU EGFM305
●Features
■Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
■Low profile surface mounted application in order to optimize board space.
■Trr less than 25ns for high efficiency
■High current & surge capability.
■Low forward dropdown voltage
■Glass passivated chip junction.
■Lead-free parts meet environmental standards of MIL-STD-19500 /228
■Suffix "-H" indicates Halogen free parts, ex. EGFM301-H.
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Chip Silicon Rectifier 、 Glass Passivated Sufrace Mount Efficient Fast Rectifiers |
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Datasheet |
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Please see the document for details |
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SMC |
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English Chinese Chinese and English Japanese |
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2009/12/10 |
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Revision B |
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DS-121522 |
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296 KB |
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