Exposed Pad Algorithm for the Medalist x6000 Automated X-Ray Inspection System Application Note
A new package design has recently emerged to address heat dissipation issues in printed circuit board (PCB) with high speed processor and memory devices. Such a design uses a heat slug inside the package to conduct heat from the die to the PCB. The heat slug is soldered to a pad that may have vias to conduct heat to internal PCB layers, to the extent of allowing an additional heat sink to be placed on the other side of the board for better heat transfer.
Different package designs have different pad patterns that connect to the heat slug. Some packages such as the Quad Flat No Lead (QFN)may have a simple rectangular pad surrounded by smaller perimeter pads. Other designs contain varying number of gaps around the edge of the pad. Yet, certain FET (Field Effect Transistor) packages can have isolated sub-pads.
Due to the crucial requirement to dissipate heat in the fastest and most efficient way, it is important to ensure good solder connection at the pad-device interface.
The Exposed Pad Algorithm in the Medalist x6000 Automated X-Ray Inspection software is designed to test all varieties of these package types for defects such as open and voiding.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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October 21,2008 |
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5989-9919EN |
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2 MB |
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