DFN/QFN Package LineUP

2025-05-25
本文档介绍了DFN/QFN封装类型,针对市场需求的小型、轻便、薄型封装,从Cu框架型和电铸引线型两种规格设计并提出了最佳封装方案。文档详细描述了Cu框架型和电铸引线型的特性,包括封装厚度、可靠性、粘接材料、引线材料、芯片安装方式等,并提供了具体的封装型号和尺寸信息。

AOI Electronics

DFN0808DFN1010DFN1212DFN1418DFN1515DFN1616DFN2020DFN3030QFN2020QFN3030QFN4040QFN5050QFN6060QFN7070QFN8080

More

Part#

DFNQFN

More

More

Datasheet

More

More

Please see the document for details

More

More

Cu框架型;电铸引线型

English Chinese Chinese and English Japanese

1.1 MB

- The full preview is over. If you want to read the whole 11 page document,please Sign in/Register -
  • +1 Like
  • Add to Favorites

Recommend

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Contact Us

Email: