TZNAIUMT6 Transistor/MOSFET SOT-363 (UMT6)

PublishTime：2025-03-21

This document provides detailed information about the TZNAIUMT6 transistor/MOSFET, including its internal structure, materials used, and bonding methods. The document also includes a table listing the materials used in the product's construction, such as mold compound, lead frame, external plating, die, and bonding wire. The die bonding method is specified as eutectic Au-Si. The document is produced by ROHM Co., Ltd., and it is important to note the safety and application considerations mentioned, as well as the limitations of the product's use in certain high-reliability applications.

Brand of Product：	ROHM
Part#：	TZNAIUMT6 More Part#
Product Category：	Transistor/MOSFET More
Application：	[ General electronic equipment ][ AV/OA devices ][ communication ][ consumer systems ][ gaming/entertainment sets ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	SOT-363 (UMT6)
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2016.1
Version Number：	Rev.A
Data Encoding：	R1102A
Data Size：	166 KB

Data section preview(2pages)

- The full preview is over,the data is 2 pages -

Download

+1 Like
Add to Favorites

Recommend

Technical Resources

More>

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Integrated Circuits