HEAT SINK COMPOUND For Thermal coupling and heat dissipation

2025-03-19
本资料文档介绍了热沉化合物,用于提高电子组件的热导率和高效散热。

KONTAKT CHEMIE

热沉化合物

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印刷电路板 ]电子组件 ]控制组件 ]

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20G管装,100G管装

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2021年11月6日

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