Stress-Free Laser Cutting and Drilling of Circuit Boards Multipurpose Systems based on the LPKF 5000 Platform

PublishTime：2025-03-19

This document details the LPKF 5000 platform-based laser systems designed for stress-free cutting and drilling of circuit boards. The systems are effective for a wide range of materials and offer high precision, speed, and quality. They are suitable for various applications, including drilling microvias, cutting complex contours, and processing IC substrates. The LPKF systems are known for their user-friendly control, flexibility, and efficiency, making them ideal for 24/7 manufacturing environments.

Brand of Product：	LPKF
Part#：	LPKF 5000 Platform More Part#
Product Category：	Laser Machining Systems for Circuit Boards More
Application：	[ Rigid Circuit Boards ][ FPCBs ][ Coverlayers ][ Flexible PCBs ][ IC Substrates ][ HDI PCBs ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：
Version Number：
Data Encoding：
Data Size：	550 KB

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