F7101 MaxTEC™ 热电导性 Form-In-Place 密封垫

2025-03-18
F7101 MaxTEC™ 热电导性 Form-In-Place 密封垫是一种双功能材料,具有优异的电磁屏蔽性能和增强的热导性能。它具有低直流通过电阻,在较小的压缩力下表现良好,适用于大多数应用。该产品采用导电硅橡胶材料,具有特殊的填充物,热阻抗低,粘附性强,适用于-45至150°C的工作温度范围。

TENNMAX

F7101

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热电导性 Form-In-Place 密封垫

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适用于电磁屏蔽和热管理 ]

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Technical Documentation

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