VSM85, 86, 87, 88, 89 - Bulk Metal® Foil Technology - Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier (LCC) Configuration

2025-03-18
VSM系列网络集成了Bulk Metal® Foil技术的所有性能特性,适用于表面贴装。多端陶瓷LCC具有金镀层端子,端子从封装侧面环绕到底部,适用于插座或表面贴装。这些网络可根据客户要求定制,请将您的原理图和电气要求发送至我们的应用工程部门(foil@vpgsensors.com),我们将分配一个唯一的零件号,该零件号定义了您网络的所有方面。产品可能不是按比例绘制的。

Texas Components Corporation

VSM85VSM86VSM87VSM88VSM89

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Part#

表面贴装密封电阻网络

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适用于各种电子电路,包括但不限于通信、计算机、消费电子等 ]

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Datasheet

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Please see the document for details

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Leadless Chip Carrier (LCC)

English Chinese Chinese and English Japanese

2014

15-Jul-2014

Doc: 63999

337 KB

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