MULTILAYER CERAMIC CHIP CAPACITORS

2025-03-18
本资料文档详细介绍了多层陶瓷芯片电容器的相关信息,包括订购代码、电容分类、介电材料、电容值、公差、额定电压、尺寸、结构、材料、测试要求、包装、存储条件、焊接建议、术语解释等。文档旨在为工程师提供全面的产品信息,以便于其在设计和应用中选择合适的陶瓷芯片电容器。

Liean-Gimn

CC 0805 Y 104 Z 160

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多层陶瓷芯片电容器

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