OSD32MP15x Datasheet

PublishTime：2025-03-17

OSD32MP15x SiP（系统级封装）设备将微处理器的全部功能集成在一个封装中，其尺寸小巧，感觉像微控制器。这些设备的核心是STMicroelectronics的STM32MP15x，它具有双核Arm® Cortex®-A7和Arm® Cortex®-M4。除了处理器，OSD32MP15x还集成了高达1GB的DDR3L、STPMIC1电源管理IC、EEPROM、MEMs振荡器和无源元件，全部封装在一个易于使用的BGA封装中。这种集成使得使用STM32MP15x进行设计变得最快，因为它消除了那些对最终系统没有价值的繁琐任务，同时允许低成本制造和微型化产品。

Brand of Product：	Octavo Systems
Part#：	OSD32MP15x More Part#
Product Category：	System-in-Package (SiP) More
Application：	[ General-purpose microcontrollers ][ industrial applications ][ automotive ][ consumer electronics ][ medical devices ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	BGA 302 Ball, 1mm Pitch
Language：	English Chinese Chinese and English Japanese
Date of Creation：	8/9/2024
Version Number：	Rev. 8
Data Encoding：	Doc: OSD32MP15x_Datasheet_Rev8
Data Size：	1.6 MB

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